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3D CONTENT CENTRAL SOIC 14 FULL

Use the BQFP Package Overall Dimensions page to set the package values.Įnter the Lead Span Range ( Minimum and Maximum), Maximum Height, and Minimum Standoff Height using the textboxes to the right of each option. The drop-down next to Layer and selecting the desired mechanical layer. Enable Add Component Body Information to include this information. You can also select the mechanical layer for the component body by using You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanicalĪ component body contains the volumetric information corresponding to the package dimensions. If desired, enter a new Line Width directly in the textbox. For each, you can use the IPC calculated dimensions or enter new values directly in The BGA Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.Įnable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width.Įnable the Use calculated silkscreen dimensions to use the displayed values or disable the checkbox and enter the desired new values in the textboxes.īGA Courtyard, Assembly and Component Body Information

The BGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. 'The pad diameter will be' statement is dynamically updated to show the current value based on the above selections. Select Reduce from nominal ball diameter (B) in percent by to define a percentage reduction of the ball diameter then enter the desired percentage value in the textbox.Select Use Least Material Condition (LMC) to use the smallest pad size (IPC recommended) for the given ball diameter.Select Use Maximum Material Condition (MMC) to use the largest pad size (IPC recommended) for the given ball diameter.The pad diameter is determined using the following methods: The BGA Pads Diameter page is used to specify the pad diameter of the footprint. If Selectively Depopulated is selected, all areas, including Add Balls to Cavity Border are accessible for updating.If Thermally Enhanced is selected, only Cavity Size and Size of Thermal Array are accessible for updating.If Perimeter is selected, only Cavity Size is accessible for updating.

3D CONTENT CENTRAL SOIC 14 FULL

If Full Matrix is selected, none of the other options of the region are available.

Selections include Full Matrix, Perimeter, Thermally Enhanced, and Selectively Depopulated. Select the matrix type from the drop-down. Selections include Plain Grid or Staggered Grid. The Add Balls to Cavity Border selections are only accessible if Selectively Depopulated is selected from the drop-down. Of the 3D STEP model in the Preview region. Click Generate STEP Model Preview on any page in the Wizard after selecting the component type to see a preview If desired, you can see a preview of the 3D STEP model before generating the model. If the current image is 3D, click the icon to further define the preview by selecting/deselecting Show Simple 3D Bodies and Show Generic Models. Click the icon then select 2D or 3D, whichever is appropriate. In the Preview region, you can click to toggle between 2DĪnd 3D preview images. On the following pages for each component type, the Preview region dynamically updates to show new location, size, etc., for several settings.

When pad trimming is applied, a warning is displayed within the dialog.

For small packages having a large central thermal pad, the peripheral pads are trimmed to ensure required clearance between the pads in accordance with the IPC Standard.

For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending under the package's body.

Paste Masks are split into small fills for packages with a large thermal pad (sized 2.1mm x 1.6mm, or larger).

Small Outline Integrated Package, 1.27mm Pitch - Gullwing Leads Plastic Leaded Chip Carrier, Square - J Leads Ceramic Dual Flat Pack - Trimmed and formed Gullwing LeadsĬeramic Quad Flat Pack - Trimmed and formed Gullwing Leads